Hjem / Sizzix Accessory – Die Brush & Foam Pad
for Wafer Thin Dies
kr 123,00 kr 87,00
Ikke på lager
Vil du bli varslet når dette produktet er tilbake på lager?
When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy maneuverability, the Die Brush easily rolls away excess paper to reveal the perfect cut! The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cutout.
Sizzix
Outlet
SL-PES-CD111 – 128x234x1mm
PÃ¥ lager
KJ-MBKJ-SCD10 – 105x148mm
KJ-MBKJ-SCD13 – 110x185mm
ABM-OOTW-CD86 – 100x160mm